Memory training and the tuning process
5.1 Preparation and a clean baseline
PDF · 45Page 45Tuning starts not with someone else's timings, but with a repeatable baseline. First prove that the system works correctly on clean JEDEC/Auto, then establish a separate XMP baseline. Old manual voltages, trained values, or hidden profile settings must not be carried between these modes.
TWO BASELINES FOR TWO DIFFERENT TASKS
| Mode | What to apply | What it is for |
|---|---|---|
| JEDEC / Auto | Load Optimized Defaults, XMP disabled; perform full training | Verify assembly, slots, SPD, boot, and baseline operation without overclocking. |
| XMP II | The complete set of parameters in the DIMM’s XMP profile; BIOS/MRC determines parameters absent from the profile. | The original XMP baseline for comparison; loading XMP II does not exclude BIOS/MRC involvement. |
| XMP I | Main DIMM XMP fields with the remaining parameters optimized by ASUS | A separate comparison branch; do not mix its results with XMP II. |
| XMP Tweaked | XMP plus additional ASUS settings for compatible kits | Enhanced ASUS profile: test only after establishing a stable baseline. |
RECORD FOR EACH SESSION
| Record | Exact information | Record | Exact information |
|---|---|---|---|
| Platform | CPU, motherboard, BIOS version, and ME | Kit | Part number, total capacity, 1R/2R, die density |
| Installation | A2/B2 on a 4-DIMM board or both Apex slots; record DIMMs per channel separately | Module type | UDIMM/CUDIMM, XMP profile, CKD mode if present |
| Conditions | DIMM airflow, room temperature | Readings | BIOS setpoints and HWiNFO sensor readings |
| Result | Boot type, Q-Code (diagnostic POST code), training time | Validation | Test, duration, temperature, and exact symptom |
5.2 ORDER FOR SELECTING THE INITIAL LOAD
PDF · 45Page 45WHY THE ORDER STARTS WITH CAPACITY, NOT MT/s
Capacity determines the available module organization and electrical load before an impressive frequency is chosen. A 2 x 48 GB kit usually requires a different strategy from 2 x 24 GB, even with the same IC manufacturer: rank count, training, ODT, temperature, and the controller's realistic ceiling all change. Gear (the controller divider) and Command Rate (the command interval) are selected after the target load. Only then does it make sense to find useful SA, TX, MC, VDD, and VDDQ ranges. This keeps every failure explainable and prevents excess voltage from masking an incorrectly chosen baseline.
5.3 What memory training is
PDF · 46Page 46Memory Reference Code (MRC) is part of Intel firmware that selects working delays, reference-voltage levels, termination, and signal compensation during startup. The result is a set of parameters with which the system can continue booting. This is not a stability test under load and not an automatic search for the best timings.
5.4 THE SAME PROFILE MAY FOLLOW DIFFERENT BOOT PATHS
PDF · 46Page 46| Scenario | What happens | What it proves |
|---|---|---|
| Full training | MRC reruns the required set of stages; POST takes noticeably longer | Repeatability of the range found during retraining, but not stability in Windows. |
| Warm restart | Warm restart without removing power; a fast path may be used | Only the profile's ability to restart through this path. |
| S5 / shutdown | The OS has shut down, but the motherboard may remain on standby power | Not equivalent to removing power and does not guarantee full retraining. |
| AC cold start | Cold boot after complete power removal | Does not promise a full MRC run if firmware uses saved data. |
| MRC Fast Boot / Fast Boot | BIOS applies a shortened MRC path | Saves time only after repeatability of full training has been demonstrated. |
| BIOS Fast Boot | Speeds up overall POST and device initialization | This is not the same as the MRC fast path. |
| Windows Fast Startup / sleep | The OS restores saved state or resumes from sleep | A separate scenario; does not replace cold/warm boot. |
ASUS SERVICE SETTINGS
| BIOS entry | Purpose | How to use it |
|---|---|---|
| MRC Fast Boot (Z790) / Fast Boot (Z890) | Shortened path through MRC | Disable while finding a profile; enable after a series of full training cycles. |
| MCH Full Check | Full MCH check; ASUS associates Enabled with stability | Auto/Enabled for a daily profile; Disabled only for a limit experiment. |
| Mem Over Clock Fail Count | Number of failed POST attempts before recovery | Do not set too high: a large number only prolongs a failed training loop. |
| Training Profile | Auto / Standard Profile / ASUS User Profile | Start with Auto; the internal difference is not publicly disclosed. |
| Mrc Training Loop Count | Exponential number of internal cycles | Not an OS stress test; leave on Auto without a specific diagnostic task. |
| Improve Training Limit (Z790 2202) | The entry exists in firmware, but its exact logic is not publicly described | Leave on Auto; do not assign it an invented frequency or voltage limit. |
| Memory Test on Warm Boot (Z790 2202) | Basic memory check on a warm restart; the entry may be hidden | For diagnostics only; does not replace OS testing. |
| Realtime Memory Timing | Allows timings to be changed after MRC_DONE | Disabled for the normal methodology; recheck the result after a full POST. |
5.5 ASUS Z790 Training Algorithms
PDF · 47Page 47The table combines the public ASUS Z790 BIOS manual with the actual Apex Encore BIOS 2202 menu. In Auto, MRC/ASUS selects the state of each function. The final column is my practical A/B scheme for Z790 Apex Encore / BIOS 2202 / 2 x 24 GB DDR5-8200. For another motherboard, CPU, kit, or BIOS, start with Auto.
| Group | BIOS entries (similar items grouped) | What it trains | Mode |
|---|---|---|---|
| Commands / CA | Early Command Training; Command Voltage Centering; Early Command Voltage Centering; Late Command Training; CMD CTL CLK Slew Rate; CMD/CTL DS & E 2D; CMD/CTL Drive Strength Up/Dn 2D | Timing, Vref, drive strength, and edges of the command/address path | Auto . |
| Initial read | SenseAmp Offset Training; Early ReadMPR Timing Centering 2D; Read MPR Training; Receive Enable Training; Receive Enable Centering 1D | Receiver calibration, MPR, and read-gate timing; affects RTL. | Auto; do not disable Receive Enable |
| Write | Jedec Write Leveling; Early Write Time Centering 2D; Write Timing Centering 1D; Write Voltage Centering 1D; Write Timing Centering 2D; Write Voltage Centering 2D | DQS-to-CK alignment and write-eye centering. | Auto / stock; do not disable JEDEC WL |
| Read | Early Read Time Centering 2D; Read Timing Centering 1D; Read Timing Centering with JR; Read Voltage Centering 1D; Read Timing Centering 2D; Read Voltage Centering 2D | One- and two-dimensional search for the center of the read eye in time and Vref. | Auto; Early Read Time 2D - Enabled for 8000+* |
| ODT / RON / drive | Dimm ODT Training; Max RTT_WR; DIMM RON Training; Read ODT Training; DIMM CA ODT Training; Write Drive Strength/Equalization 2D; Write Slew Rate Training; Write Driver Strength Training; Write Drive Strength Up/Dn independently | DIMM/channel termination and drive strength. Manual Ω values are covered in 5.9. | Auto; Max RTT_WR - ODT OFF, 120 Ω for A/B only |
| Equalization | Read Equalization Training; Read Amplifier Training | Correction of receiver-path loss and distortion. | Auto |
| Compensation | Comp Optimization Training; TxDqTCO Comp Training; ClkTCO Comp Training; TxDqsTCO Comp Training; VccDLL Bypass Training; PanicVttDnLp Training; Read Vref Decap Training; Vddq Training | PVT, PHY delays, DLL, and reference levels; do not transfer between CPUs/BIOS versions. | Auto; Vddq: Auto → Disabled after voltages are fixed* |
| DCC | Duty Cycle Correction Training; Periodic DCC; Tx Dqs Dcc Training | Correction of CK/DQS duty cycle and its drift. | Auto |
| RTL / transitions | Round Trip Latency; Turn Around Timing Training | Round-trip delay and RD↔WR intervals; related to frequency, WTR, ranks, and topology. | RTL - Enabled; TAT: Auto → Disabled after manual turnaround settings* |
| DDR5 signal | DIMM DFE Training; EARLY DIMM DFE Training; DRAM EMPHASIS Training; DRAM DCA Training; DQS OFFSET ADJUST Training | DFE/DCA; DRAM EMPHASIS and DQS OFFSET ADJUST behavior is not disclosed. | Auto |
| Margin / test | Rank Margin Tool Per Bit; Rank Margin Tool; Memory Test; DIMM SPD Alias Test; Post Package Repair Training; Retrain Margin Check; Margin Check Limit; Margin Limit Check L2 | Service margin checks; do not prove OS stability. | Auto; RMT/Test - temporarily Enabled for diagnostics |
| Not for this manual | LPDDR DqDqs Re-Training | Applies to LPDDR, not desktop DDR5 DIMMs. | Not applicable |
5.6 ASUS Z890 Training Algorithms
PDF · 48Page 48The Z890 menu exposes more PHY/MRC stages. The starting scheme below uses the ASUS manual and my recommendations. I leave most stages on Auto; choices for manual timing adjustments are shown in the table and Chapter 06.
| Group | BIOS entries (similar items grouped) | What it trains | Mode |
|---|---|---|---|
| Commands / CA | Early Command Training; CA ODT Optimization; Command Voltage Centering; Late Command Training; CMD CTL CLK Slew Rate; CMD/CTL Drive Strength; CMD/CTL Tx Equalization; DIMM CA ODT Training | Command/address path, its termination, drive strength, and equalization. | Auto |
| Initial read | SenseAmp Offset Training; Early ReadMPR Timing Centering 2D; Read MPR Training; Receive Enable Training | Preparation of receivers and MPR data-capture boundaries. | Auto; do not disable Receive Enable |
| Write | Jedec Write Leveling; Early Write Time Centering 2D; Unmatched Write Time Centering 1D; Write Timing Centering 1D/2D; Write Voltage Centering 1D/2D | Write leveling/centering; Unmatched details are undisclosed. | Auto; do not disable JEDEC WL |
| Read | Early Read Time Centering 2D; Read Timing Centering 1D/2D; Read Voltage Centering 1D/2D; RxVref Per-Bit Training | Read-eye center in time/voltage and RxVref Per-Bit Training. | Auto; change Early Read Time 2D only as a separate A/B test |
| ODT / RON | DDR5 ODT Timing Config; Read DQS ODT Training; Read DQ ODT Training; Dimm ODT Training; DIMM RON Training | DQ and DQS are separate; enter manual resistances from the trained baseline. | Auto |
| EQ / DFE | Read Equalization Training; Read CTLE Training; DIMM DFE Training; Ddr5 Rx Cross-Talk Cancellation; Write Drive Strength; Write Equalization | Correction of frequency-dependent loss, reflections, and crosstalk. | Auto; do not disable DFE without an A/B test |
| Compensation | TxDqTCO Comp Training; ClkTCO Comp Training; Pre Training Comp Calibration; Comp Optimization; Ref PI Calibration; Rx SAL Calibration; VccClk FF Offset Correction; Data PI Linearity Calibration; Unmatched Rx Calibration; LVR Auto Trim | Phases, delays, PVT, and PHY power; do not transfer between CPUs/BIOS versions. | Auto |
| DCC | Duty Cycle Correction Training; Downstream; QCLK; Rise/Fall; Functional DCC for DDR5 DQS, CLK and Data DQ | Extended duty-cycle correction for different DDR5 paths. | Auto |
| Mapping / ranks | DQ/DQS Swizzle Training; Write Rank-to-Rank Training; Read Rank-to-Rank Training; Turn Around Timing Training; Write DQ/DQS Retrain | Line mapping, rank-to-rank transitions, and DQ/DQS retraining. | Auto; TAT Disabled with manual tertiary timings |
| Margin / protection | Rank Margin Tool; Rank Margin Tool Per Bit; Retrain Margin Check; Margin Check Limit; Margin Limit Check L2; Row Hammering Prevention; Post Package Repair | Signal margin, retraining decisions, and protection; does not replace OS tests. | Auto; margin checks for diagnostics only |
| Service | View Pin Calibration; Power Saving Meter Update; Read Vref Decap Training; Vddq Training; DIMM SPD Alias Test | Service calibrations and checks; internal logic is not fully disclosed. | Auto; disable Vddq Training only as a separate A/B test |
| Not for DDR5 DIMMs | Functional DCC for LP5 WCK; Duty Cycle Correction for LP5 DCA | LPDDR5 entries in the shared menu do not apply to UDIMM/CUDIMM. | Not applicable |
5.7 RTL/IOL training
PDF · 49Page 49WHAT RTL IS ON DDR5
RTL is Round-Trip Latency, the delay of the full read path. In Intel documentation for Alder Lake / Raptor Lake, it is the interval from the READ command until the first data returns to the memory controller, expressed in QCLK cycles. Training selects receiver parameters while accounting for the CPU, motherboard, modules, and settings. RTL is not CAS or AIDA64 latency.
IOL is I/O Latency. On DDR4, it is a separate I/O delay setting. On DDR5, receiver parameters and their availability depend on the platform and BIOS; the old RTL/IOL pairing cannot be carried over.
WHAT TO USE AS YOUR REFERENCE
The main reference is repeatability on your own stable profile. Under identical conditions, a higher RTL, a new spread between corresponding entries, and boot-to-boot jumps are warning signs, especially when accompanied by repeated POST attempts, test errors, or performance loss.
1. Create comparable conditions. Save frequency, Gear, CAS, voltages, BIOS, and ME in a profile. Compare several full training cycles using the same boot method: a restart with MRC Fast Boot may reuse a saved result.
2. Record the result of each boot. Compare the same active controller, subchannel, and rank positions. Note boot time and Karhu / y-cruncher errors; measure performance the same way each time.
3. Change one parameter. If the result varies, test a lower frequency or looser CAS, then voltages separately. Repeat training and tests to verify reproducibility.
WHY THE RESULT MAY CHANGE
| Factor | What to check |
|---|---|
| Frequency and CAS | High frequency and tight timings reduce stability margin. Returning to a validated profile helps distinguish the overclocking limit from a random training result. |
| Voltages | An unsuitable memory or controller voltage, including too much voltage, can reduce stability. RTL cannot identify the required power rail or direction of adjustment. |
| BIOS and boot | BIOS / ME version, Auto rules, and reuse of training results can change the comparison conditions. After changing BIOS, first establish a new baseline series of boots. |
MANUALLY LOWERING RTL IN BIOS
For EVGA DARK, the community reported RTL reductions of 1-2, supposedly by lowering CAS: the RTL block would then train according to the selected CAS. ASUS Z790 documents RTL Init / Max, a signed Offset, and rank fields. I tested these blocks and concluded that they should remain on Auto. The motherboard should perform the training itself. If the result is unusable, diagnose it (see the glossary). For Z690 Tachyon, there are reports that manual entry does not work and recommendations to enable RTL training; no conclusion has been established for Z790.
anta777 EMPIRICAL FORMULA
anta777 has an empirical formula for estimating RTL. Effective DDR5 data rate in MT/s and CAS in cycles are entered into it, and the result is used as an approximate reference.
A technically exact universal relationship has not been confirmed. Do not force every utility entry to 65 / 66. The rule that "RTLA rounds down and RTLB rounds up" cannot be considered universal: when the fractional part is below 0.50, the lower integer RTLB value also occurs. In this case, this is an observation from readings, not proof of the BIOS rounding algorithm.
XTREEM CASE STUDY: 8200 AND 8400 MT/s
ASUS ROG Maximus Z790 Apex Encore, TEAMGROUP T-Force XTREEM 2 x 24 GB, Gear 2. We compare ATC readings for three profiles: 8200 @ tCL38, 8200 @ tCL36, and 8400 @ tCL38.
| ATC entry | Controller and DDR5 path | 8200 @ tCL38 | 8200 @ tCL36 | 8400 @ tCL38 |
|---|---|---|---|---|
| MC0 C0 A1/A2 | MC0, group A, subchannel C0 | 72/25 | 70/25 | 72/25 |
| MC0 C1 A1/A2 | MC0, group A, subchannel C1 | 67/25 | 65/25 | 67/25 |
| MC1 C0 B1/B2 | MC1, group B, subchannel C0 | 73/25 | 71/25 | 73/25 |
| MC1 C1 B1/B2 | MC1, group B, subchannel C1 | 67/25 | 65/25 | 67/25 |
How to read an entry. MC0 / MC1 are controller blocks; C0 / C1 are the two 32-bit DDR5 paths within each block. A1/A2 and B1/B2 label groups of positions in ATC. Apex Encore physically has two slots.
What 70/25 means. The slash separates two RTL readings in one entry. 70 applies to the occupied position; 25 in the second position matches Intel's reset value of 0x19. For this 1R kit, 25 is consistent with an unused position.
Relationship to the formula. At 8200, C1 matches the lower integer from the anta777 estimate: 67.25 -> 67 at tCL38, 65.25 -> 65 at tCL36. At 8400 @ tCL38, the estimate is 67.5, but C1 stays at 67; the entire RTL block matches 8200 @ tCL38. C0 is 5 / 6 above C1. The formula does not directly describe the whole block; the screenshots do not explain the offset or rounding algorithm.
The basic validation remains the same: several full training cycles, comparison with a stable profile, tests, and identical performance measurements. My 8200 @ tCL36 profile also showed RTL 64/65. One screenshot proves neither normal behavior nor an error. Under the confirmed conversion conditions in Section 5.7 (p. 47), at 8200 MT/s and Gear 2 one QCLK is approximately 0.488 ns: a difference of 5-6 conditionally corresponds to 2.44-2.93 ns. The ATC 4.1.7 scaling on this system has not been confirmed. This is a calculated read interval, not a measurement of overall latency or stability margin.
I treat Apex and other prominent 2-DIMM motherboards as the benchmark for correct, fast RTL training when comparing them with other boards, especially 4-DIMM models.
WHAT TO ACCOUNT FOR ON Z890
On Z890 / Core Ultra 200S, use documentation and a utility intended for that platform: field names, units, and training procedures may differ. ASUS BIOS includes Training Consistency, which may improve training repeatability but does not replace testing. Z790 numbers and offsets, including the anta777 estimate, cannot automatically be treated as targets for Z890.
5.8 What changed on Z890: CUDIMM, CKD, and DIMM Fit
PDF · 51Page 51The public menu separates Read DQ/DQS ODT more precisely, exposes more PHY calibrations, and adds Training Consistency and the DIMM Fit family. The absence of an old name does not prove removal of the algorithm: it may have been merged, renamed, or hidden within the MRC.
| Category | Examples | How to interpret the change |
|---|---|---|
| Retained | MCH Full Check; Training Profile; Mrc Training Loop Count; margin tools | The principle is unchanged; margin and the result depend on the new IMC/PHY and BIOS. |
| Renamed / split | MRC Fast Boot -> Fast Boot; Read ODT -> Read DQS ODT + Read DQ ODT | Compare by function, but do not treat every name as a direct 1:1 mapping. |
| Exposed for the first time | CA ODT Optimization; CTLE; RxVref Per-Bit; crosstalk; rank-to-rank; DCC | More observation points, not an obligation to switch each one manually. |
| Not visible as a separate entry | RTL, Max RTT_WR, Write Slew Rate, Read Amplifier, TxDqsTCO, Memory Test, and other Z790 entries | They are merely absent from the public Z890 manual; this does not prove removal from the MRC. |
CUDIMM: CKD RESTORES THE CLOCK BUT DOES NOT TRAIN THE DATA PATH
DIMM FIT: AUTOMATIC SEARCH FROM A GIVEN STARTING POINT
| Function | What is available | Practical caveat |
|---|---|---|
| DIMM Fit | Store0 / Store1 / Store2 and deletion of the selected Store | Run it from a bootable baseline; the result is not yet a daily profile. |
| DIMM Fit Pro | Up to 20 parameters with ranges; Fail to Next advances to the next parameter early. | The transition criterion follows the BIOS User Guide. ASUS recommends 2 cycles; do not turn off power. |
| Training Consistency | Attempts to make training results more repeatable | Only when full retraining varies; start with Auto. |
WHAT REMAINS VALID AFTER AUTOMATIC TUNING
DIMM Fit optimizes parameters only relative to the current starting point. After changing frequency, Gear, voltage, kit, or CKD mode, repeat training and tests for the saved Store. CKD improves clock-signal quality on CUDIMM, but does not prevent read/write data errors caused by unsuitable Vref/ODT settings or memory temperature. High Z890 frequencies cannot be explained by one CKD entry or attributed to Gear 4.
5.9 DDR5 resistances: ODT, RTT, and RON
PDF · 52Page 52FOR ADVANCED USERS. GENERALLY NEEDED FOR EXTREME OVERCLOCKING. FOR ORDINARY TUNING, ALWAYS LEAVE THESE SETTINGS ON AUTO.
ODT is line termination integrated into the die; RTT is its selected effective resistance; RON is the output resistance of the active transmitter. A lower number means stronger termination or output drive, but not automatically a better signal: excessive strength also creates ringing, overshoot, and crosstalk.
WHAT THE RESISTANCES ACTUALLY CONTROL
| Parameter | When active | First A/B direction | What counts as improvement |
|---|---|---|---|
| RTT_WR | Target rank receives a write | DQ RTT WR: Auto/readback -> adjacent setting | A repeatable range of correct writes after several full training cycles |
| RTT_NOM_RD / WR | Non-target rank while reading/writing another rank | Change RD and WR one at a time; especially important for 2R/2DPC | Better rank-to-rank transitions without regression in the opposite direction |
| RTT_PARK / DQS | Rank is idle or parked | One PARK domain at a time | Repeatable cold/warm boot |
| DRAM RON | DRAM transmits data during a read | Pull-up/down: one adjacent setting after Auto | Improved read and training behavior, not a single successful POST |
| CA / CS / CK ODT | Commands, rank select, clock | GroupA/B only after a POST/training failure has been demonstrated | A series of cold-training cycles, not one successful boot |
PRACTICAL POINTS FOR Z790 / Z890 APEX, STARTING AT 8400 MT/S
All resistances are in Ω. Historical examples do not replace Auto or validation on your own system.
| Board / context | MT/s | Exact values / first step | What the source establishes |
|---|---|---|---|
| White Z790 Apex BIOS 1801 02/2024 | 8400–8600 | Auto. Historical RON: PU/PD 40/34; 34/40. RTT and Groups: Auto. | Veii: a PCB-dependent comparison point [2]. Advice in a discussion, without a complete validated stable profile. |
| Z790 Apex Encore 02/2024 experiments | 8533; 8600 target | RON: MC00 48/40; MC01 40/48 (PU/PD, source labels). No ready-made RTT preset. | Veii / tibcsi0407 [3, 4]: pairs and improvement after TX tuning are reported. This does not establish stable 8600–8800+. |
| Z890 Apex, UDIMM BIOS 3202; 285K; 2 × 16 GB A-die | 8800 search → 8600 test | CHA RTT NOM RD 48; CHB RTT NOM RD 60, NOM WR 40, PARK DQS 120. | UNIKO, DIMM Fit Pro [5]: four changed fields. Other actual resistances are not listed. ODT tuning alone did not pass the final validation stage. |
| Z890 Apex, CUDIMM | 8800–9000+ target | Auto; supported DIMM Fit / Pro if needed. Record the result. | No transferable RTT/RON set was established in the reviewed sources. CKD does not replace DQ RTT; do not copy UDIMM CK ODT. |
5.10 Profiles and recovery
PDF · 53Page 53Save a working step after each completed stage. Then a failed timing or voltage change will not force you to rebuild the profile: you can quickly return to the last repeatable point and test the next hypothesis separately.
Changing frequency or Gear requires retesting voltage ranges and training repeatability. When changing the CPU, kit, capacity, occupied slots, BIOS version, or UDIMM/CUDIMM type, it is safer to start from the baseline profile.
PROFILE LADDER: ROLLBACK SHOULD TAKE SECONDS
RECOVERY ORDER AFTER A FAILED POST
| Step | Recovery | What to do | What is preserved |
|---|---|---|---|
| 1 | Wait | DDR5 training can take noticeable time; assess Q-Code and repeatability | Entire profile |
| 2 | ReTry | Retry POST with the same settings | Entire profile |
| 3 | Safe Boot | Safe boot: temporarily load conservative parameters and correct the OC | Manual fields |
| 4 | Working step | Load the previous profile | Validated baseline |
| 5 | Clear CMOS | Clear settings if BIOS is inaccessible; use FlashBack (BIOS recovery) only for a firmware problem | Previously exported copy |